{"title":"Miniaturized polarization sensors integrated with wire-grid polarizers","authors":"So Ikeda, E. Higurashi, T. Suga, T. Oguchi","doi":"10.1109/ICEP.2014.6826712","DOIUrl":null,"url":null,"abstract":"Miniaturized polarization sensors integrated with aluminum (Al) nanowire-grid polarizers have been developed for compact optical rotary encoders. The sensor consists of Al wire grid polarizers sandwiched between two glass substrates, an InGaAs photodiode (PD) chip and a Si substrate with a cavity and through silicon vias (TSVs). Two polarizers that can detect two orthogonally polarized components were integrated in a single device. The glass substrates with wire-grid polarizers were vertically stacked on the Si substrate for chip size packaging. Integration of PD chips and sealing were performed using Au-Au surface activated bonding using atmospheric-pressure plasma with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C. The feasibility of rotational angle measurement of linear polarizer was demonstrated by differential detection of two orthogonally polarized components.","PeriodicalId":195433,"journal":{"name":"2014 International Conference on Electronics Packaging (ICEP)","volume":"149 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEP.2014.6826712","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Miniaturized polarization sensors integrated with aluminum (Al) nanowire-grid polarizers have been developed for compact optical rotary encoders. The sensor consists of Al wire grid polarizers sandwiched between two glass substrates, an InGaAs photodiode (PD) chip and a Si substrate with a cavity and through silicon vias (TSVs). Two polarizers that can detect two orthogonally polarized components were integrated in a single device. The glass substrates with wire-grid polarizers were vertically stacked on the Si substrate for chip size packaging. Integration of PD chips and sealing were performed using Au-Au surface activated bonding using atmospheric-pressure plasma with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C. The feasibility of rotational angle measurement of linear polarizer was demonstrated by differential detection of two orthogonally polarized components.