H. Kudo, T. Yonekawa, S. Yoshimi, Y. Oguri, A. Tsukune, Y. Kim, H. Kitada, K. Fjimoto, I. Kinefuchi, Y. Matsumoto, T. Ohba
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引用次数: 2
Abstract
A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C3S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the Pmax of 1 × 104 Pa and Qmax of 38 μl/min. Cooling capability as high as 140 W/cm2 was demonstrated for the first time.
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