Comparative study of PWB pad cratering subject to reflow soldering and thermal impact

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI:10.1109/ECTC.2010.5490929

Chaoran Yang, F. Song, S. Lee, K. Newman

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引用次数: 10

Abstract

Pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under the dynamic loading. In recent years, the increasing propensity of pad cratering due to the implementation of the lead-free technology calls for the necessity of re-assessment of PWB qualification related to the pad cratering resistance. The objective of the present study is to establish a test method for evaluating the pad cratering resistance of PWB and studying the PWB degradation mechanism subject to different high temperature conditions. Three kinds of PWB with different resin systems were investigated, including one phenolic-cured system board and two dicy-cured system boards. Tg and Td of the selected PWBs were characterized using TMA and TGA. The detailed cold ball pull test procedure is presented and different pull jaws with/without standoff are evaluated in this paper. The effects of multiple reflows, thermal aging and temperature cycling on the pad cratering resistance of PWBs are discussed as well.

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回流焊与热冲击对PWB焊盘成形的影响

在各种板级可靠性试验中，尤其是在动载荷作用下，焊盘撞击是主要的失效形式之一。近年来，由于无铅技术的实施，焊盘击穿的可能性越来越大，因此有必要重新评估与焊盘抗击穿相关的PWB资格。本研究的目的是建立一种评估压水板耐垫坑性能的测试方法，研究不同高温条件下压水板的降解机理。研究了三种不同树脂体系的印制板，包括一种酚醛固化体系板和两种酚醛固化体系板。采用TMA和TGA对所选PWBs的Tg和Td进行了表征。本文给出了详细的冷球拉力试验程序，并对不同的拉爪进行了评估。讨论了多次回流、热老化和温度循环对印制板抗焊坑性能的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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