Characterization of SIMOX material with channeled and unchanneled oxygen implantation

M. Twigg, L. Allen, B.J. Mrstik, L.T. Ardis
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Abstract

It is a goal of electronic materials fabrication efforts to produce SIMOX with a low dislocation density in the superficial Si layer (the device layer) as well as a buried oxide (BOX) layer consisting of high quality SiO/sub 2/. In this paper, we study the effects of varying the implantation angle in a search for the optimal implantation conditions from the standpoint of both the BOX and the device layer. Using transmission electron microscopy (TEM) and spectroscopic ellipsometry (SE), we show that there is a significant difference between channeled and unchanneled implantation in SIMOX.<>
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通道氧和非通道氧注入SIMOX材料的表征
在表面硅层(器件层)和由高质量SiO/ sub2 /组成的埋藏氧化物(BOX)层中生产具有低位错密度的SIMOX是电子材料制造努力的目标。本文从BOX层和器件层两个角度研究了不同注入角度对寻找最佳注入条件的影响。利用透射电子显微镜(TEM)和椭圆偏振光谱(SE),我们发现在SIMOX中有沟道和无沟道注入存在显著差异。
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A feasibility study of SiC on oxide by wafer bonding and layer transferring A 1-M bit SRAM on SIMOX material Characterization of SIMOX material with channeled and unchanneled oxygen implantation Radiation effects in BESOI structures with different insulating layers A bulk-JFET and CMOS/SIMOX technology for low noise, high speed charge-sensitive amplifier
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