{"title":"An integral equation approach to the prediction of the capacitance and the inductance of a via through-hole","authors":"P. Kok, D. De Zutter","doi":"10.1109/EPEP.1993.394571","DOIUrl":null,"url":null,"abstract":"A quasi-static method is described for calculating the excess capacitance and inductance of via's. The considered via geometry contains connecting strips, pads on the via, and finite ground plane thickness. The influence of the pad size and the size of the ground plane opening on the via capacitance, inductance and impedance is examined.<<ETX>>","PeriodicalId":338671,"journal":{"name":"Proceedings of IEEE Electrical Performance of Electronic Packaging","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1993.394571","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A quasi-static method is described for calculating the excess capacitance and inductance of via's. The considered via geometry contains connecting strips, pads on the via, and finite ground plane thickness. The influence of the pad size and the size of the ground plane opening on the via capacitance, inductance and impedance is examined.<>
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