S. Simovich, S. Mehrotra, P. Franzon, M. Steer, Z. Rakib, G. Simpson
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引用次数: 2
Abstract
A new methodology is presented in which the signal integrity engineer and the design engineer interact with automation tools to produce a printed circuit board (PCB) or multi-chip module (MCM) layout. The focus is on how the signal integrity engineer uses these tools for greatest success.<>
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