{"title":"New electrothermal system level model for RF power amplifier","authors":"J. Mazeau, R. Sommet, D. Caban-Chastas, E. Gatard","doi":"10.1109/EMICC.2007.4412644","DOIUrl":null,"url":null,"abstract":"This paper considers a new approach for nonlinear system level models dedicated to high RF power amplifiers. The constant increase of power density imposes to take into account of thermal effects. In this framework, a new electro-thermal behavioral model based on the coupling between a behavioral electrical model and a thermal reduced model predicting the operating temperature of the amplifier is expressed for radar application. This model has been successfully implemented into the Agilent Advanced Design System (ADS) circuit simulator. The transient thermal effects have been simulated thanks to an envelope transient analysis.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 European Microwave Integrated Circuit Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMICC.2007.4412644","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper considers a new approach for nonlinear system level models dedicated to high RF power amplifiers. The constant increase of power density imposes to take into account of thermal effects. In this framework, a new electro-thermal behavioral model based on the coupling between a behavioral electrical model and a thermal reduced model predicting the operating temperature of the amplifier is expressed for radar application. This model has been successfully implemented into the Agilent Advanced Design System (ADS) circuit simulator. The transient thermal effects have been simulated thanks to an envelope transient analysis.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
