Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System

Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daehwan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Joungho Kim
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引用次数: 10

Abstract

In this paper, for the first time, we propose a processing-in-memory in high bandwidth memory (PIM-HBM) architecture for high bandwidth systems with low dynamic random-access memory (DRAM) access costs. The main concept of the proposed PIM-HBM architecture is to embed processing units into a logic base of high bandwidth memory (HBM) to decrease the energy consumption and latency of interconnections as the physical length between core and DRAM decreases. To verify the proposed PIM-HBM architecture, we designed on-chip and on-interposer I/O channels using a CMOS 0.18 µm process. We extracted channel parasitic using an electromagnetic (EM) solver and performed a SPICE simulation to compare the system performance of the proposed architecture with the conventional HBM. As a result, the performance of the proposed PIM-HBM architecture is successfully verified by reducing energy consumption and latency of interconnections by 77 % and 79 % compared to the conventional HBM system.
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高带宽系统中具有高能效和低延迟信道的PIM-HBM结构中的内存处理
在本文中,我们首次提出了一种高带宽内存(PIM-HBM)架构,用于具有低动态随机存取存储器(DRAM)访问成本的高带宽系统。所提出的PIM-HBM架构的主要概念是将处理单元嵌入到高带宽存储器(HBM)的逻辑基础中,以减少核心和DRAM之间的物理长度减少时的能耗和互连延迟。为了验证所提出的PIM-HBM架构,我们使用CMOS 0.18µm工艺设计了片上和中间体上的I/O通道。我们使用电磁(EM)求解器提取通道寄生,并进行SPICE仿真,以比较所提出架构与传统HBM的系统性能。结果表明,与传统的HBM系统相比,所提出的PIM-HBM架构的性能得到了成功验证,其能耗和互连延迟分别降低了77%和79%。
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