C. Patel, P. Andry, K. Jenkins, B. Dang, R. Horton, R. Polastre, C. Tsang
{"title":"Characterization of flip chip microjoins up to 40 GHz using silicon carrier","authors":"C. Patel, P. Andry, K. Jenkins, B. Dang, R. Horton, R. Polastre, C. Tsang","doi":"10.1109/IITC.2005.1499952","DOIUrl":null,"url":null,"abstract":"Electrical characterization results of fine pitch flip chip interconnections, called microjoins, using a silicon carrier are reported. Microjoins with 50 /spl mu/m diameter, 100 /spl mu/m pitch are assembled onto a silicon carrier and characterized up to 40 GHz using transmission line test macros. Time and frequency domain measurements of a single 50 /spl mu/m diameter microjoin give 6 ps delay and less than -0.5 dB transmission losses up to 40 GHz.","PeriodicalId":156268,"journal":{"name":"Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.","volume":"199 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2005.1499952","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Electrical characterization results of fine pitch flip chip interconnections, called microjoins, using a silicon carrier are reported. Microjoins with 50 /spl mu/m diameter, 100 /spl mu/m pitch are assembled onto a silicon carrier and characterized up to 40 GHz using transmission line test macros. Time and frequency domain measurements of a single 50 /spl mu/m diameter microjoin give 6 ps delay and less than -0.5 dB transmission losses up to 40 GHz.
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