{"title":"Reliability and conduction mechanism study on organic ultra low-k (k=2.2) for 65/45 nm hybrid Cu damascene technology","authors":"Y. Su, J. Shieh, B. Perng, S. Jang, M. Liang","doi":"10.1109/IITC.2005.1499921","DOIUrl":null,"url":null,"abstract":"We have developed an integrated approach for Cu/hybrid low k interconnects. Implementation of this method to 65/45 nm dual damascene was performed using a hybrid film stack consisting of porous SiLK (p-SiLK, k=2.2) and CVD SiOC (k=3.0). The damage to p-SiLK in plasma clean is prevented by pore sealing and an effective k value as low as 2.6 was extracted from the bias temperature stress (BTS) experiments. From BTS, it is found that Frenkel-Poole (FP) emission dominates the leakage mechanism in p-SiLK. The proposed hybrid approach demonstrates /spl sim/21% reduction in RC product and shows excellent electrical and reliability (EM and SM) performance comparable to the conventional Cu/SiOC (k=3.0) damascene.","PeriodicalId":156268,"journal":{"name":"Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.","volume":"135 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2005.1499921","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
We have developed an integrated approach for Cu/hybrid low k interconnects. Implementation of this method to 65/45 nm dual damascene was performed using a hybrid film stack consisting of porous SiLK (p-SiLK, k=2.2) and CVD SiOC (k=3.0). The damage to p-SiLK in plasma clean is prevented by pore sealing and an effective k value as low as 2.6 was extracted from the bias temperature stress (BTS) experiments. From BTS, it is found that Frenkel-Poole (FP) emission dominates the leakage mechanism in p-SiLK. The proposed hybrid approach demonstrates /spl sim/21% reduction in RC product and shows excellent electrical and reliability (EM and SM) performance comparable to the conventional Cu/SiOC (k=3.0) damascene.
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