{"title":"Package induced low-k delaminations: Numerical developments and experimental investigations to address FEBE compatibility fracture phenomena.","authors":"S. Gallois-Garreignot, V. Fiori, D. Nélias","doi":"10.1109/ESIME.2009.4938430","DOIUrl":null,"url":null,"abstract":"The development of Cu/low-k interconnects to meet continuous tighter specifications (lower RC time delay, power consumption…) and consequently the introduction of mechanically weak materials is widely identified as a contributor of interfacial cracks propagating during manufacturing flow or qualification tests. Moreover, a raise in Front-End/Back-End (FE/BE) compatibility issues has been also observed and tends to narrow process windows from both Front-End to packaging steps.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2009.4938430","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The development of Cu/low-k interconnects to meet continuous tighter specifications (lower RC time delay, power consumption…) and consequently the introduction of mechanically weak materials is widely identified as a contributor of interfacial cracks propagating during manufacturing flow or qualification tests. Moreover, a raise in Front-End/Back-End (FE/BE) compatibility issues has been also observed and tends to narrow process windows from both Front-End to packaging steps.
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