S. Dempwolf, L. Hofmann, Christopher Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach
{"title":"Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors","authors":"S. Dempwolf, L. Hofmann, Christopher Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach","doi":"10.23919/LTB-3D.2017.7947409","DOIUrl":null,"url":null,"abstract":"This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer-printing. These technologies are described on sensor devices.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947409","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer-printing. These technologies are described on sensor devices.
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