{"title":"Effect of Mechanical Stress on the Electrical Characteristics of Different Type IGBT Chips","authors":"Yihui Zhang, Jinyuan Li, Yinghan Liu, Guanbin Wu","doi":"10.1109/SSLChinaIFWS49075.2019.9019764","DOIUrl":null,"url":null,"abstract":"IGBT power semiconductor devices are widely used in modern power systems, and their electrical characteristics directly affect the performance of converters. Firstly, the influence of mechanical stress on the electrical characteristics of MOSFET and IGBT chips is summarized. The way of mechanical stress generation in IGBT module is summarized from two aspects of chip technology and packaging technology, and the electrical characteristics of different types of IGBT chips are also discussed. The effects of mechanical stresses in different directions on the electrical characteristics of different types of IGBT chips are analyzed.","PeriodicalId":315846,"journal":{"name":"2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SSLChinaIFWS49075.2019.9019764","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
IGBT power semiconductor devices are widely used in modern power systems, and their electrical characteristics directly affect the performance of converters. Firstly, the influence of mechanical stress on the electrical characteristics of MOSFET and IGBT chips is summarized. The way of mechanical stress generation in IGBT module is summarized from two aspects of chip technology and packaging technology, and the electrical characteristics of different types of IGBT chips are also discussed. The effects of mechanical stresses in different directions on the electrical characteristics of different types of IGBT chips are analyzed.