Multiphysics simulation for the reliability analysis of large-scale interconnects

Abstract

A coupled electrical-thermal-mechanical simulation technique is developed for the reliability analysis of interconnects. The multi-physics simulation is based on the finite element method and characterizes electrical, thermal, and mechanical, aspects of interconnects simultaneously. The multi-physics simulation is capable of analyzing large-scale problems with a significantly enhanced computational efficiency. The efficiency enhancement is achieved by using a domain decomposition scheme called the finite element tearing and interconnecting, parallel computing, and the localized nature of thermal stresses. A numerical example is provided to demonstrate both the capability and efficiency of the proposed simulation.