{"title":"Evaluation of near-singular integrals for quadrilateral basis in integral equation solver","authors":"C. Luo, Giacomo Bianconi, Swagato Chakraborty","doi":"10.1109/EDAPS.2016.7874405","DOIUrl":null,"url":null,"abstract":"The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2016.7874405","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.
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