Broadband material model identification with GMS-parameters

Abstract

Design and compliance analysis of PCB and packaging interconnects for 10–50 Gbps and higher data rates should begin with the identification of broadband dielectric and conductor roughness models. Such models are not available from manufacturers and the model identification is the most important element of successful interconnect design. Broadband model identification with generalized modal S-parameters (GMS-parameters) is outlined and compared with the standardized Short Pulse Propagation (SPP) technique. Practical examples of successful dielectric and conductor roughness model identification up to 50 GHz are also provided.