{"title":"Mechanism for early failure in Cu dual damascene structure","authors":"Dae-Yong Kim, S.S. Wong","doi":"10.1109/IITC.2003.1219772","DOIUrl":null,"url":null,"abstract":"An infrared microscope and a convergent electron beam technique have been applied to detect and analyze the weak via in a Cu dual Damascene contact chain. It is shown that the early failure is due to cracking in the barrier metal layer, which opens up a fast diffusion path along the interface between the barrier metal and the dielectric. The subsequent opening and, in some cases, self-recovery of the via is also discussed. This early failure mode may impose severe limitation on the scalability of the dual Damascene structure.","PeriodicalId":212619,"journal":{"name":"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2003.1219772","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
An infrared microscope and a convergent electron beam technique have been applied to detect and analyze the weak via in a Cu dual Damascene contact chain. It is shown that the early failure is due to cracking in the barrier metal layer, which opens up a fast diffusion path along the interface between the barrier metal and the dielectric. The subsequent opening and, in some cases, self-recovery of the via is also discussed. This early failure mode may impose severe limitation on the scalability of the dual Damascene structure.
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