Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

I. Mohammed, K. Liechti
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引用次数: 2

Abstract

Bimaterial corners arise in many modem structural components from structural adhesively bonded joints to line structures in microelectronics devices. The elasticity problem has been extensively analyzed (Williams, 1952, Bogy, 1971, Hein and Erdogan, 1971) and it has been shown that singularities in stress can arise, depending on the properties of the materials and the corner geometry. These singularities (or eigenvalues) may be complex in nature and a number of them may co-exist for a particular configuration. Various schemes have been developed for extracting the stress intensity factors (or eigenvectors) associated with each singular term (Stem et al, 1976, Carpenter and Byers, 1987).
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双材料边角裂纹成核的莫尔干涉分析
双材料角出现在许多现代结构元件中,从结构粘接接头到微电子器件中的线结构。弹性问题已被广泛分析(Williams, 1952, Bogy, 1971, Hein和Erdogan, 1971),并且已经表明,根据材料的性质和角的几何形状,应力可能出现奇点。这些奇点(或特征值)在本质上可能是复杂的,并且对于特定的配置,它们中的许多可能共存。已经开发了各种方案来提取与每个奇异项相关的应力强度因子(或特征向量)(Stem等人,1976年,Carpenter和Byers, 1987年)。
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