{"title":"Measurement of Solder-Copper Interfacial Fracture Parameters Using u2-Displacement Fields","authors":"H. Tippur, H. Krishnamoorthy","doi":"10.1115/imece1997-1230","DOIUrl":null,"url":null,"abstract":"\n Moiré interferometry is used for mapping elasto-plastic deformations in 63/37 solder-copper bimaterials subjected to predominantly tensile loading. A method for quantifying the fracture parameter — the J-integral — using full-field measurement of u2-displacements has been developed. A linear relationship between crack tip opening displacements (CTOD) and the J-integral is demonstrated. The crack growth resistance curve and hence crack initiation toughness JC for the bimaterial is obtained. Full-field optical information has also suggested the possibility of using a simpler method for the J-integral estimation using a single strain gage.","PeriodicalId":230568,"journal":{"name":"Applications of Experimental Mechanics to Electronic Packaging","volume":"318 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applications of Experimental Mechanics to Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece1997-1230","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Moiré interferometry is used for mapping elasto-plastic deformations in 63/37 solder-copper bimaterials subjected to predominantly tensile loading. A method for quantifying the fracture parameter — the J-integral — using full-field measurement of u2-displacements has been developed. A linear relationship between crack tip opening displacements (CTOD) and the J-integral is demonstrated. The crack growth resistance curve and hence crack initiation toughness JC for the bimaterial is obtained. Full-field optical information has also suggested the possibility of using a simpler method for the J-integral estimation using a single strain gage.
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