{"title":"A Deterministic-Statistical Multiple-Defect Diagnosis Methodology","authors":"Soumya Mittal, R. D. Blanton","doi":"10.1109/VTS48691.2020.9107603","DOIUrl":null,"url":null,"abstract":"Software diagnosis is the process of locating and characterizing a defect in a failing chip. It is the cornerstone of failure analysis that consequently enables yield learning and monitoring. However, multiple-defect diagnosis is challenging due to error masking and unmasking effects, and exponential complexity of the solution search process. This paper describes a three-phase, physically-aware diagnosis methodology called MDLearnX to effectively diagnose multiple defects, and in turn, aid in accelerating the design and process development. The first phase identifies a defect that resembles traditional fault models. The second and the third phases utilize the X-fault model and machine learning to identify correct candidates. Results from a thorough fault injection and simulation experiment demonstrate that MD-LearnX returns an ideal diagnosis 2X more often than commercial diagnosis. Its effectiveness is further evidenced through a silicon experiment, where, on average, MD-LearnX returns 5.3 fewer candidates per diagnosis as compared to state-of-the-art commercial diagnosis without losing accuracy.","PeriodicalId":326132,"journal":{"name":"2020 IEEE 38th VLSI Test Symposium (VTS)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 38th VLSI Test Symposium (VTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTS48691.2020.9107603","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Software diagnosis is the process of locating and characterizing a defect in a failing chip. It is the cornerstone of failure analysis that consequently enables yield learning and monitoring. However, multiple-defect diagnosis is challenging due to error masking and unmasking effects, and exponential complexity of the solution search process. This paper describes a three-phase, physically-aware diagnosis methodology called MDLearnX to effectively diagnose multiple defects, and in turn, aid in accelerating the design and process development. The first phase identifies a defect that resembles traditional fault models. The second and the third phases utilize the X-fault model and machine learning to identify correct candidates. Results from a thorough fault injection and simulation experiment demonstrate that MD-LearnX returns an ideal diagnosis 2X more often than commercial diagnosis. Its effectiveness is further evidenced through a silicon experiment, where, on average, MD-LearnX returns 5.3 fewer candidates per diagnosis as compared to state-of-the-art commercial diagnosis without losing accuracy.