A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, T. Sitnik-Nieters
{"title":"Ultra low loss millimeter wave MCM interconnects","authors":"A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, T. Sitnik-Nieters","doi":"10.1109/EPEP.1997.634073","DOIUrl":null,"url":null,"abstract":"We present the design and development of ultra low loss and high density organic interconnect packaging technology at millimeter wave frequencies. Various microstrip passive components have been designed and characterized to demonstrate that the high density organic interconnect approach is suitable for W-band (75 GHz-110 GHz) packaging. The loss of the organic interconnects has been found to be comparable with that of microstrip lines on alumina substrates at W-band frequencies.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634073","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
We present the design and development of ultra low loss and high density organic interconnect packaging technology at millimeter wave frequencies. Various microstrip passive components have been designed and characterized to demonstrate that the high density organic interconnect approach is suitable for W-band (75 GHz-110 GHz) packaging. The loss of the organic interconnects has been found to be comparable with that of microstrip lines on alumina substrates at W-band frequencies.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
