A low-cost technique for reducing simultaneous switching noise in a sub-board packaging configuration has been developed. By using a thin insulator film made of conventional FR4 substrate material, the noise is reduced about 50% when 32 switching gates are simultaneously driven at 622.08 Mb/s in a sub-board with an area of 11/spl times/10 cm.
{"title":"Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations","authors":"S. Koike, K. Kaizu","doi":"10.1109/96.730428","DOIUrl":"https://doi.org/10.1109/96.730428","url":null,"abstract":"A low-cost technique for reducing simultaneous switching noise in a sub-board packaging configuration has been developed. By using a thin insulator film made of conventional FR4 substrate material, the noise is reduced about 50% when 32 switching gates are simultaneously driven at 622.08 Mb/s in a sub-board with an area of 11/spl times/10 cm.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"137 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126917314","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-12-01DOI: 10.1109/EPEP.1997.634083
Sangwoo Kim, D. Neikirk
A compact skin effect circuit model is used to formulate a time domain boundary condition for lossy transmission lines. The resulting lossless-like multiconductor equations can be used in various time domain calculations, including FDTD.
{"title":"Time domain multiconductor transmission line analysis using effective internal impedance","authors":"Sangwoo Kim, D. Neikirk","doi":"10.1109/EPEP.1997.634083","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634083","url":null,"abstract":"A compact skin effect circuit model is used to formulate a time domain boundary condition for lossy transmission lines. The resulting lossless-like multiconductor equations can be used in various time domain calculations, including FDTD.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123845458","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-27DOI: 10.1109/EPEP.1997.634074
R. Ito, R. Jackson
A circuit model for multi-port flipped-chip packaging of microwave integrated circuits is described. The model topology includes the effect of non-ideal isolation between IC ports and predicts resonance behavior in the millimeterwave range. Measurements of a scale model four port are used for verification.
{"title":"Circuit modeling of isolation in flip-chip microwave integrated circuits","authors":"R. Ito, R. Jackson","doi":"10.1109/EPEP.1997.634074","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634074","url":null,"abstract":"A circuit model for multi-port flipped-chip packaging of microwave integrated circuits is described. The model topology includes the effect of non-ideal isolation between IC ports and predicts resonance behavior in the millimeterwave range. Measurements of a scale model four port are used for verification.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125590893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-27DOI: 10.1109/EPEP.1997.634028
L. Smith
The power distribution system will become an increasingly important package design consideration for computer systems such as the Sun Microsystems desktop workstation, at least as important as simultaneous switch. Power distribution impedance is controlled by the switching power supply, bulk capacitance, ceramic capacitance and power plane properties at various portions of the frequency spectrum. A major concern with package power is resonance between chip capacitance and package inductance. The key parameters for package power are the core power supply loop inductance and the inductance and resistance used to connect any decoupling capacitors on the package. Decoupling capacitors on the package can be used but they will not be effective unless the connections to them are specially designed using aggressive technologies.
{"title":"Packaging and power distribution design considerations for a Sun Microsystems desktop workstation","authors":"L. Smith","doi":"10.1109/EPEP.1997.634028","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634028","url":null,"abstract":"The power distribution system will become an increasingly important package design consideration for computer systems such as the Sun Microsystems desktop workstation, at least as important as simultaneous switch. Power distribution impedance is controlled by the switching power supply, bulk capacitance, ceramic capacitance and power plane properties at various portions of the frequency spectrum. A major concern with package power is resonance between chip capacitance and package inductance. The key parameters for package power are the core power supply loop inductance and the inductance and resistance used to connect any decoupling capacitors on the package. Decoupling capacitors on the package can be used but they will not be effective unless the connections to them are specially designed using aggressive technologies.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"53-54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130328900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-27DOI: 10.1109/EPEP.1997.634069
G. Lee, Hai-Young Lee
Leakage phenomena of flip-chip structures on common GaAs and alumina main substrates are characterized using the spectral domain approach to reduce the possible chip-to-chip crosstalk and transmission resonance. We have found that the longitudinal section magnetic mode is dominant for the coplanar waveguide leakage and the leakage can be suppressed by properly managing the gap height and the main substrate thickness in addition to the dielectric constant.
{"title":"Suppression of leakage and crosstalk in typical millimeter-wave flip-chip packages","authors":"G. Lee, Hai-Young Lee","doi":"10.1109/EPEP.1997.634069","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634069","url":null,"abstract":"Leakage phenomena of flip-chip structures on common GaAs and alumina main substrates are characterized using the spectral domain approach to reduce the possible chip-to-chip crosstalk and transmission resonance. We have found that the longitudinal section magnetic mode is dominant for the coplanar waveguide leakage and the leakage can be suppressed by properly managing the gap height and the main substrate thickness in addition to the dielectric constant.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124308789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-27DOI: 10.1109/EPEP.1997.634059
Q. Liu, Y. Li, J. Liao
Conventional finite-difference time-domain (FDTD) methods are very inefficient for simulations of electromagnetic wave propagation in large-scale complex media. This is mainly because of the low-accuracy associated with the spatial discretization in the FDTD methods. As a result, even for a moderate size problem, a large number of cells (typically 10-20 cells per wavelength) are required to obtain reasonably accurate results. This requirement becomes much more stringent for large-scale problems since the dispersion error grows rapidly with the propagation distance. Recently a pseudospectral time-domain (PSTD) algorithm has been developed which requires only two cells per wavelength regardless of the problem size. In terms of spatial discretization, this method is an optimal time-domain solution since it has an infinite order of accuracy in the spatial representation. For a problem with structures much smaller than the smallest wavelength, the PSTD algorithm still provides high accuracy up to a much higher spatial frequency than FDTD methods. In addition, the only error introduced in the PSTD algorithm is the temporal discretization. Unlike the dispersion error in FDTD methods, this error is isotropic and does not increase with the scale of the problem. In this work, we apply the PSTD method to characterize the electrical performance of electronic packages. In particular, it is used to investigate the effects of enclosure resonance and electromagnetic interference.
{"title":"The PSTD algorithm: a fast and accurate time-domain method for electronic package characterization","authors":"Q. Liu, Y. Li, J. Liao","doi":"10.1109/EPEP.1997.634059","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634059","url":null,"abstract":"Conventional finite-difference time-domain (FDTD) methods are very inefficient for simulations of electromagnetic wave propagation in large-scale complex media. This is mainly because of the low-accuracy associated with the spatial discretization in the FDTD methods. As a result, even for a moderate size problem, a large number of cells (typically 10-20 cells per wavelength) are required to obtain reasonably accurate results. This requirement becomes much more stringent for large-scale problems since the dispersion error grows rapidly with the propagation distance. Recently a pseudospectral time-domain (PSTD) algorithm has been developed which requires only two cells per wavelength regardless of the problem size. In terms of spatial discretization, this method is an optimal time-domain solution since it has an infinite order of accuracy in the spatial representation. For a problem with structures much smaller than the smallest wavelength, the PSTD algorithm still provides high accuracy up to a much higher spatial frequency than FDTD methods. In addition, the only error introduced in the PSTD algorithm is the temporal discretization. Unlike the dispersion error in FDTD methods, this error is isotropic and does not increase with the scale of the problem. In this work, we apply the PSTD method to characterize the electrical performance of electronic packages. In particular, it is used to investigate the effects of enclosure resonance and electromagnetic interference.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125748021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-27DOI: 10.1109/EPEP.1997.634053
R. Kollipara, L. Lin, G. Oehrle
Electrical characterization of various SSO (simultaneous switching output) buffers placed on the periphery and in the core of a flip-chip is performed. The multilayer CBGA package has multiple power and ground planes and signal routing layers. Methodology guide lines are developed based on the characterization results.
{"title":"Characterization of peripheral and core SSOs in a flip-chip package","authors":"R. Kollipara, L. Lin, G. Oehrle","doi":"10.1109/EPEP.1997.634053","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634053","url":null,"abstract":"Electrical characterization of various SSO (simultaneous switching output) buffers placed on the periphery and in the core of a flip-chip is performed. The multilayer CBGA package has multiple power and ground planes and signal routing layers. Methodology guide lines are developed based on the characterization results.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127956484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-27DOI: 10.1109/EPEP.1997.634046
Sang-Ki Yun, Hai-Young Lee
Crosstalk of picosecond pulses in bondwires for plastic packaging is analyzed using the full-wave method of moments (MoM) and the FFT algorithm, showing that the static crosstalk model of SPICE is inappropriate for the high-speed package design. Plastic packaging materials significantly increase bondwire crosstalk due to the mutual electromagnetic coupling enhanced by the dielectric and radiation effects.
{"title":"Wideband crosstalk analysis of coupled bondwires buried in high-speed plastic packages","authors":"Sang-Ki Yun, Hai-Young Lee","doi":"10.1109/EPEP.1997.634046","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634046","url":null,"abstract":"Crosstalk of picosecond pulses in bondwires for plastic packaging is analyzed using the full-wave method of moments (MoM) and the FFT algorithm, showing that the static crosstalk model of SPICE is inappropriate for the high-speed package design. Plastic packaging materials significantly increase bondwire crosstalk due to the mutual electromagnetic coupling enhanced by the dielectric and radiation effects.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121953646","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-27DOI: 10.1109/EPEP.1997.634040
T. Gazizov, N. Leontiev
Characteristics of single and coupled suspended and inverted microstrip lines are calculated by variational method. Experimental waveforms for usual and suspended microstrip are compared. The possibilities of reduction of high-speed signal distortions in PCBs with such lines are shown.
{"title":"Reduction of high-speed signal distortions in double-layered dielectric PCB interconnects","authors":"T. Gazizov, N. Leontiev","doi":"10.1109/EPEP.1997.634040","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634040","url":null,"abstract":"Characteristics of single and coupled suspended and inverted microstrip lines are calculated by variational method. Experimental waveforms for usual and suspended microstrip are compared. The possibilities of reduction of high-speed signal distortions in PCBs with such lines are shown.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129926834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-27DOI: 10.1109/EPEP.1997.634043
G. Klemens, V. Aparin, K. Gard
A technique is presented for increasing the accuracy of package models produced by static simulation through segmentation of conductors. The lumped circuit elements are better distributed along the leads than when whole conductors are used.
{"title":"The enhancement of static simulator package characterization through conductor segmentation","authors":"G. Klemens, V. Aparin, K. Gard","doi":"10.1109/EPEP.1997.634043","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634043","url":null,"abstract":"A technique is presented for increasing the accuracy of package models produced by static simulation through segmentation of conductors. The lumped circuit elements are better distributed along the leads than when whole conductors are used.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"141 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130957417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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