Test Challenges of Multi-Gigabit Serial Buses

Michael Fluet, P. Gilenberg
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引用次数: 1

Abstract

As the complexity and bandwidth requirements of modern avionics increase, new high speed digital buses are needed to support these requirements, and bring with them unique test challenges. Parallel bus interfaces often begin to exhibit problems with timing alignment and signal integrity when data rates approach several hundred Mbps. By converting single-ended parallel interfaces to differential signaling, their use can be extended to around 1 Gbps. As data rates rise beyond 1 Gbps, parallel buses become unusable due to skew issues and are replaced by multi-gigabit serial buses that alleviate the problems of parallel buses and can provide much higher data rates. As multi-gigabit serial buses become more prevalent in automated test, test engineers are finding that these buses come with their own set of test challenges. Multi-gigabit serial buses over copper media are difficult to interface and require special attention be paid to signal integrity and use of emphasis and equalization to produce a reliable test interface. Higher bandwidth test interfaces require generation, sourcing, processing, and storage of large amounts of test data. Some of the physical challenges of high speed serial buses over copper media can be resolved with optical interfaces. However, optical interfaces present yet again a new set of challenges. While traditional signal integrity is no longer a problem with optical interfaces, signal attenuation and optical link budgets must be understood. This paper discusses the progression from parallel data buses to electrical multi-gigabit serial buses to optical multi-gigabit serial buses, and beyond. Test challenges that must be addressed with each type of interface are discussed in detail. By understanding these test challenges, a test engineer can be prepared to reliably interface to and test modern avionics.
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多千兆串行总线的测试挑战
随着现代航空电子设备复杂性和带宽要求的增加,需要新的高速数字总线来支持这些要求,同时也带来了独特的测试挑战。当数据速率接近几百Mbps时,并行总线接口通常开始出现时序校准和信号完整性问题。通过将单端并行接口转换为差分信号,它们的使用可以扩展到1gbps左右。当数据速率超过1gbps时,并行总线就会因为倾斜问题而无法使用,并被千兆串行总线所取代,从而缓解并行总线的问题,并提供更高的数据速率。随着多千兆串行总线在自动化测试中越来越普遍,测试工程师发现这些总线带来了自己的一组测试挑战。铜介质上的多千兆串行总线难以接口,需要特别注意信号完整性,并使用强调和均衡来产生可靠的测试接口。更高带宽的测试接口需要生成、获取、处理和存储大量的测试数据。高速串行总线在铜介质上的一些物理挑战可以通过光学接口来解决。然而,光接口再次提出了一系列新的挑战。虽然传统的信号完整性不再是光接口的问题,但必须了解信号衰减和光链路预算。本文讨论了从并行数据总线到电气多千兆串行总线再到光多千兆串行总线及其以后的发展。详细讨论了每种类型的接口必须解决的测试挑战。通过了解这些测试挑战,测试工程师可以准备可靠地连接和测试现代航空电子设备。
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