T. Kakegami, S. Ohi, K. P. Sengendo, H. Tokuda, M. Kuzuhara
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引用次数: 1
Abstract
This paper describes comparative study of current collapse in AlGaN/GaN high-electron-mobility transistors (HEMTs) passivated with sputter-deposited SiO2 and SiNx dielectrics. The pulsed I-V measurements are employed to characterize switching response of the devices. It is found that the degree of current collapse for the SiNx-passivated device is superior to that for the SiO2-passivated device.