M. Fukuda, F. Ichikawa, H. Sato, Y. Hibino, K. Moriwaki, S. Tohno, T. Sugie, J. Yoshida
{"title":"Plastic packaging of semiconductor laser diodes","authors":"M. Fukuda, F. Ichikawa, H. Sato, Y. Hibino, K. Moriwaki, S. Tohno, T. Sugie, J. Yoshida","doi":"10.1109/ECTC.1996.550875","DOIUrl":null,"url":null,"abstract":"Two kinds of plastic molded laser modules, the coaxial type and the board type, are developed aiming at lower cost laser modules. Under various environmental and endurance tests, these modules show potential for high reliability. The performance of these modules seem comparable to that of hermetically sealed modules used in commercial transmission systems. They are potentially suitable for low cost optical sources in transmission systems.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.550875","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12
Abstract
Two kinds of plastic molded laser modules, the coaxial type and the board type, are developed aiming at lower cost laser modules. Under various environmental and endurance tests, these modules show potential for high reliability. The performance of these modules seem comparable to that of hermetically sealed modules used in commercial transmission systems. They are potentially suitable for low cost optical sources in transmission systems.
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