{"title":"IC Masks - The Challenges of the Newest Technologies","authors":"M. Niewczas","doi":"10.23919/mixdes55591.2022.9837980","DOIUrl":null,"url":null,"abstract":"We review major problems and technical challenges related to mask making A.D. 2022. This overview is addressed to engineers dealing with physical design of ICs. Two significant advances have been just introduced to the volume manufacturing in transition from 7nm to 5nm process nodes: EUV lithography and multibeam mask writing. Combined, they improve accuracy, process margin and wafer throughput. However, they introduce various challenges and opportunities that we discuss here. Moreover, on the software side, two critical issues are being addressed currently, the data volume explosion and tremendous computational requirement. These are being addressed with the move to new data formats, curvilinear geometry and new algorithms utilizing supercomputing on GPU clusters.","PeriodicalId":356244,"journal":{"name":"2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/mixdes55591.2022.9837980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We review major problems and technical challenges related to mask making A.D. 2022. This overview is addressed to engineers dealing with physical design of ICs. Two significant advances have been just introduced to the volume manufacturing in transition from 7nm to 5nm process nodes: EUV lithography and multibeam mask writing. Combined, they improve accuracy, process margin and wafer throughput. However, they introduce various challenges and opportunities that we discuss here. Moreover, on the software side, two critical issues are being addressed currently, the data volume explosion and tremendous computational requirement. These are being addressed with the move to new data formats, curvilinear geometry and new algorithms utilizing supercomputing on GPU clusters.
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