{"title":"Mold compound selection study for CMOS90 176 lead LQFP 24×24mm package","authors":"Teng Seng Kiong, I. Ruzaini, S. Hian","doi":"10.1109/IEMT.2012.6521769","DOIUrl":null,"url":null,"abstract":"Semiconductor chip packages is getting more challenging nowadays with increase of I/O and lead counts, especially for thin and large body packages such as LQFP (Low Profile Quad Flat Packages) and TQFP (Thin Quad Flat Packages). Material selection for such package especially for automotive product is a key for qualification success and long term package reliability to meet industry requirement. This paper presents mold compound selection and development works done with several mold compound candidates from different mold compound suppliers, which include screening of candidates based on assembly output response, package reliability stress study as well as molding parameters optimization and establishment for selected mold compound for CMOS90 176 lead LQFP 24×24mm package. Mold compound properties of each compound candidate were studied.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2012.6521769","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Semiconductor chip packages is getting more challenging nowadays with increase of I/O and lead counts, especially for thin and large body packages such as LQFP (Low Profile Quad Flat Packages) and TQFP (Thin Quad Flat Packages). Material selection for such package especially for automotive product is a key for qualification success and long term package reliability to meet industry requirement. This paper presents mold compound selection and development works done with several mold compound candidates from different mold compound suppliers, which include screening of candidates based on assembly output response, package reliability stress study as well as molding parameters optimization and establishment for selected mold compound for CMOS90 176 lead LQFP 24×24mm package. Mold compound properties of each compound candidate were studied.
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