Investigation of A New Method to Weigh the Data Used for OPC Model Calibration

Abstract

The OPC (optical proximity correction) models need to be more accurate to simulate and predict the resist contours on the wafer of a specific process. The wafer data used for the calibration of the OPC models has a significant impact on the performance of the OPC models. This paper demonstrated a weighing method for the data to build the OPC model by weighing different data with different weights according to the feature. With the weighing method we put forward, the mean fitting error and rms (root mean square) of OPC model built were reduced.