209mW 11Gbps 130GHz CMOS transceiver for indoor wireless communication

K. Katayama, M. Motoyoshi, K. Takano, L. Yang, M. Fujishima
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引用次数: 11

Abstract

CMOS millimeter-wave transceivers have realized over 10Gbps communication for proximity communication within 10cm distance. To increase the communication distance for indoor applications, the output power of transmitters should be increased. However, it has been difficult to simultaneously realize high power efficiency together with low power consumption and the wideband required for 10Gbps communication in the power amplifiers used in transmitters. To realize 10Gbps communication for indoor applications with CMOS technology, the co-design of a modulator with low impedance variation and a wideband power amplifier is proposed by adopting amplitude-shift keying. The proposed transceiver is fabricated using a 40nm CMOS process, and is the first transceiver to realize 11Gbps with a communication distance of 3m and has a power consumption of 208.9mW. The transmitter realized maximum 2.8dBm output power with 77mW power consumption using a power amplifier with a 3dB bandwidth of 18GHz.
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209mW 11Gbps 130GHz CMOS收发器,用于室内无线通信
CMOS毫米波收发器实现了10Gbps以上的通信,可实现10cm距离内的近距离通信。为了增加室内应用的通信距离,应提高发射机的输出功率。然而,在发射机中使用的功率放大器中,很难同时实现高功率效率、低功耗和10Gbps通信所需的宽带。为了利用CMOS技术实现室内10Gbps通信,提出了采用移幅键控的低阻抗变换器和宽带功率放大器协同设计方案。该收发器采用40nm CMOS工艺制造,是首个实现11Gbps,通信距离为3m,功耗为208.9mW的收发器。发射机采用3dB带宽为18GHz的功率放大器,以77mW的功耗实现最大2.8dBm输出功率。
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