Overcoming the solid solubility limit of Te in Ge by ion implantation and pulsed laser melting recrystallization

D. Caudevilla, Y. Berencén, S. Algaidy, F. Zenteno, J. Olea, E. Andrés, R. García-Hernansanz, A. del Prado, D. Pastor, E. García‐Hemme
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Abstract

Germanium hyperdoped with deep level donors, such as tellurium, would lead to dopant-mediated sub-band gap mid-infrared photoresponse at room temperature. We use a combination of non-equilibrium techniques to supersaturate Ge with Te via ion implantation followed by pulsed laser melting (PLM). Typically, liquid N2 (77K) temperatures are used to avoid implantation-induced Ge surface porosity. In this work, alternatively, we report on the use of slightly higher implantation temperatures (143 K) together with an amorphous Si (a-Si) capping layer. We demonstrate that the solid solubility limit of Te in Ge is overcome upon recovering the crystallinity of the material after laser processing.
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离子注入和脉冲激光熔融再结晶技术克服了Te在Ge中的固溶极限
在室温下,锗与碲等深能级给体超掺杂会导致掺杂剂介导的亚带隙中红外光响应。我们使用非平衡技术的组合,通过离子注入和脉冲激光熔化(PLM)使Ge和Te过饱和。通常使用液态N2 (77K)温度来避免植入引起的Ge表面孔隙。在这项工作中,我们报告了使用稍高的注入温度(143 K)和非晶硅(a-Si)盖层。我们证明了在激光加工后恢复材料的结晶度后,克服了Te在Ge中的固溶极限。
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