2D Analytical calculation of the source/drain access resistance in DG-MOSFET structures

T. Holtij, M. Schwarz, A. Kloes, B. Iñíguez
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引用次数: 2

Abstract

Since DG-MOSFETs reached channel length down to 20nm, the parasitic source/drain resistances get more important and can't be neglected. To calculate these resistances in such devices a two-dimensional model in analytical closed-form has been derived by using the conformal mapping technique. Additionally, the model is able to predict the parasitic resistances for DG-MOSFETs with raised source drain (RSD) structures and/or wrapped contacts. The influence of source/drain geometries on access resistances is accurately described and a bias dependency is obtained by introducing two fitting parameters. The model is compared with the parasitic source/drain resistances determined from TCAD device simulations.
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DG-MOSFET结构源极/漏极通路电阻的二维解析计算
由于dg - mosfet的通道长度低至20nm,寄生源/漏极电阻变得更加重要,不可忽视。为了计算这类器件的电阻,利用保角映射技术导出了解析封闭形式的二维模型。此外,该模型能够预测具有凸起源漏(RSD)结构和/或包裹触点的dg - mosfet的寄生电阻。准确地描述了源/漏几何形状对通路电阻的影响,并通过引入两个拟合参数获得了偏置依赖关系。将该模型与从TCAD器件仿真中确定的寄生源漏电阻进行了比较。
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Analytical drain current model reproducing advanced transport models in nanoscale double-gate (DG) MOSFETs A simulation study of N-shell silicon nanowires as biological sensors Modeling of thermal network in silicon power MOSFETs 2D Analytical calculation of the source/drain access resistance in DG-MOSFET structures From bulk toward FDSOI and silicon nanowire transistors: Challenges and opportunities
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