Reliability considerations for implantable medical ICs

M. Porter, P. Gerrish, L. Tyler, S. Murray, R. Mauriello, F. Soto, G. Phetteplace, S. Hareland
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引用次数: 22

Abstract

Implantable medical devices continue to grow in complexity, mirroring the ascent of the semiconductor industry along the Moorepsilas Law curve. Traditionally, implantable applications have taken a fast-follower approach to silicon adoption, using more mature technologies to reduce risk. While commercial manufacturers, in some circumstances, may be able to trade off lifetime requirements for performance, this is decidedly not the case for implantable use, where 10 to 12 year requirements are typical. On the other hand, hardware and software redundancy solutions employed by high reliability avionics, telecommunications, and servers are difficult to implement in a battery-powered device, where current drain restrictions are severe. This paper discusses some of the reliability challenges faced by implantable device manufacturers as the need to provide more sophisticated therapy and diagnostics requires increasingly advanced technologies.
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植入式医疗集成电路的可靠性考虑
植入式医疗设备的复杂性继续增长,反映了半导体行业沿着摩尔塞拉斯定律曲线的上升。传统上,植入式应用采用快速跟随的方法来采用硅,使用更成熟的技术来降低风险。虽然在某些情况下,商业制造商可能会为了性能而权衡使用寿命的要求,但对于植入式应用来说,情况显然不是这样,通常需要10到12年。另一方面,高可靠性航空电子设备、电信和服务器所采用的硬件和软件冗余解决方案很难在电池供电的设备中实现,因为这些设备的电流损耗限制很严格。本文讨论了植入式设备制造商面临的一些可靠性挑战,因为需要提供更复杂的治疗和诊断,需要越来越先进的技术。
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