Modeling of Delta-I noise in digital electronics packaging

Yuzhe Chen, Zhonghua Wu, Amit Agrawal, Yaowu Liu, J. Fang
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引用次数: 35

Abstract

Delta-I noise, which refers to the voltage fluctuations between power and ground conductors caused by sudden current surges, has been well recognized as a limiting factor for the reliable operation of high-speed integrated circuits. A novel technique for modeling Delta-I noise associated with power and ground planes is presented in this paper. This new approach considers not only the wave propagation and resonance in power and ground planes, also the geometry of the interconnections such as the via radius, which results in accurate prediction of the Delta-I noise waveforms. An electromagnetic field solver is employed to model the power/ground planes connected with vias, and is linked to SPICE type circuit solvers to analyze the components off the planes. This simulation technique is found to be very fast in computation speed and also highly accurate. Simulation results are provided together with a comparison of Delta-I analysis performed by the method of this paper and IBM's ASTAP.<>
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数字电子封装中δ 1噪声的建模
Delta-I噪声是指由突然的电流浪涌引起的电源和地导体之间的电压波动,它已被公认为是高速集成电路可靠运行的限制因素。本文提出了一种模拟与电源和地平面相关的δ - 1噪声的新方法。这种新方法不仅考虑了波在功率和地平面上的传播和共振,还考虑了互连的几何形状,如通孔半径,从而准确地预测了δ - 1噪声波形。电磁场求解器用于对与过孔相连的电源/地平面进行建模,并与SPICE型电路求解器连接以分析平面外的元件。该仿真技术计算速度快,精度高。给出了仿真结果,并将本文方法与IBM的ASTAP进行的Delta-I分析进行了比较。
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