R. Day, C.D. Hruska, K. Tai, R. Frye, M. Lau, P. Sullivan
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引用次数: 20
Abstract
To address the needs of cost driven, mixed signal applications, we have developed a silicon-on-silicon technology that incorporates both passive and active devices in the module substrate. The technology combines a simple, double-diffused epitaxial bipolar technology with our thin-film MCMs. We describe the basic elements of the technology, typical active device properties and some examples of their use in a low-cost MCM.<>
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