{"title":"Design and analysis of wafer-level vacuum-encapsulated disk resonator gyroscope using a commercial MEMS process","authors":"Balaadithya Uppalapati, M. Ahamed, V. Chodavarapu","doi":"10.1109/NAECON.2017.8268754","DOIUrl":null,"url":null,"abstract":"We present the design and analysis of a mode-matched disk resonator gyroscope that is characterized by a high quality factor exceeding 1 million. The mode match resonator is designed using geometric compensation technique for reducing frequency split between two degenerate modes. The gyroscope sensor is designed using MEMS Integrated Design for Inertial Sensors (MIDIS) process offered by Teledyne DALSA Semiconductor Incorporated (TDSI). The MIDIS process offers ultra clean wafer-level vacuum encapsulation at 10m Torr. Our disk resonator gyroscope has a circular shape with 600 μm diameter and is made with 40 μm thick single crystal silicon material.","PeriodicalId":306091,"journal":{"name":"2017 IEEE National Aerospace and Electronics Conference (NAECON)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2017-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE National Aerospace and Electronics Conference (NAECON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NAECON.2017.8268754","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
We present the design and analysis of a mode-matched disk resonator gyroscope that is characterized by a high quality factor exceeding 1 million. The mode match resonator is designed using geometric compensation technique for reducing frequency split between two degenerate modes. The gyroscope sensor is designed using MEMS Integrated Design for Inertial Sensors (MIDIS) process offered by Teledyne DALSA Semiconductor Incorporated (TDSI). The MIDIS process offers ultra clean wafer-level vacuum encapsulation at 10m Torr. Our disk resonator gyroscope has a circular shape with 600 μm diameter and is made with 40 μm thick single crystal silicon material.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
