CAE Durability Simulation of Vibration Sweep Tests

Abstract

This paper presents a simulation method for vibration sweep tests of components and interconnects. The paper introduces the computational method to determine cumulative fatigue damage as a function of the stress-frequency response, the sweep rate and the testing time, demonstrates the “local stress-strain” approach to predict the non-linear (elastic-plastic) stress at the potential failure sites through the linear dynamic finite element analysis in the frequency domain. As an application example, the analysis procedure and computational results for the aluminum wire-bonding between a silicon chip and printed wiring board are presented.