O. Aubel, S. Thierbach, R. Seidel, B. Freudenberg, M. Meyer, F. Feustel, J. Poppe, M. Nopper, A. Preusse, C. Zistl, K. Weide-Zaage
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引用次数: 10
Abstract
Reliability of copper interconnect systems is very sensitive to the maximum current used in the product. In this paper we present the results of advanced process improvements leading to very reliable full-build interconnect systems ready for high volume production. Besides the electromigration investigation, we studied stress migration performance as well as BTS and leakage measurements. We found behavior changes in almost all reliability tests suggesting differences in physical behavior, while exhibiting very strong lifetime performance.
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