Ultra-broadband common collector-cascode 4-cell distributed amplifier in 250nm InP HBT technology with over 200 GHz bandwidth

S. Giannakopoulos, K. Eriksson, I. Darwazeh, Z. He, H. Zirath
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引用次数: 15

Abstract

An ultra broadband MMIC amplifier is designed using InP double-heterojunction bipolar transistors and its on-chip measurements are reported. The multi-cell distributed amplifier uses four gain cells where each consists of a common collector input stage followed by a cascode gain stage. The chip includes bias, decoupling and terminating circuits for the dc and RF interconnects; it measures 0.72 mm by 0.4 mm. It consumes 210 mW of power and can deliver up to 5.5 dBm of output power at 195 GHz. The amplifier achieves an average gain of 13.5 dB with an overall bandwidth over 200 GHz and a ± 2 dB gain ripple. The measurements indicate that this is the widest band dc-coupled amplifier reported to date and has the highest bandwidth reported among non-cascaded distributed amplifiers.
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采用250nm InP HBT技术的超宽带共集电极级联码4单元分布式放大器,带宽超过200ghz
采用InP双异质结双极晶体管设计了一种超宽带MMIC放大器,并对其进行了片上测量。多单元分布式放大器使用四个增益单元,其中每个增益单元由一个公共集电极输入级和一个级联增益级组成。该芯片包括用于直流和射频互连的偏置、去耦和终端电路;它的尺寸为0.72毫米乘0.4毫米。它消耗210兆瓦的功率,在195 GHz时可以提供高达5.5 dBm的输出功率。该放大器的平均增益为13.5 dB,总带宽超过200 GHz,增益纹波为±2 dB。测量结果表明,这是迄今为止报道的带宽最宽的直流耦合放大器,并且在非级联分布式放大器中具有最高的带宽。
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