The Wall Ahead is Made of Rubber

K. Flautner
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引用次数: 3

Abstract

Silicon technology evolution over the last four decades has yielded an exponential increase in integration densities with continual improvements of performance and power consumption at each technology generation. This steady progress has created a sense of entitlement for the riches that future process generations would bring. Today, however, classical process scaling seems to be dead and living up to technology expectations requires continuous innovation at many levels, which comes at steadily progressing implementation and design costs. Solutions to problems need to cut across layers of abstractions and require coordination between software, architecture and circuit features.
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前面的墙是用橡胶做的
在过去的四十年里,硅技术的发展已经产生了集成密度的指数级增长,每一代技术的性能和功耗都在不断提高。这种稳定的进展创造了一种对未来过程代将带来的财富的权利感。然而,今天,经典的流程扩展似乎已经死亡,要达到技术期望需要在许多层面上不断创新,这需要稳步推进实现和设计成本。问题的解决方案需要跨越抽象层,并且需要软件、架构和电路特性之间的协调。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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