Edge effect prediction in real MOS insulator using test chips

J. Yugami, A. Hiraiwa
{"title":"Edge effect prediction in real MOS insulator using test chips","authors":"J. Yugami, A. Hiraiwa","doi":"10.1109/ICMTS.1990.161706","DOIUrl":null,"url":null,"abstract":"Proposes an analytic method of predicting pattern edge enhanced leakage currents in MOS capacitors with arbitrary geometry, based on test chip I-V measurements. The predicted results are in good agreement with experimental results. Using this method, it becomes possible to qualitatively compare the magnitudes of edge effects under different processing conditions. It is concluded that this method will be a powerful tool for developing high-reliability insulators in future LSIs.<<ETX>>","PeriodicalId":417292,"journal":{"name":"Proceedings of the 1991 International Conference on Microelectronic Test Structures","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1991 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1990.161706","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

Proposes an analytic method of predicting pattern edge enhanced leakage currents in MOS capacitors with arbitrary geometry, based on test chip I-V measurements. The predicted results are in good agreement with experimental results. Using this method, it becomes possible to qualitatively compare the magnitudes of edge effects under different processing conditions. It is concluded that this method will be a powerful tool for developing high-reliability insulators in future LSIs.<>
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用测试芯片预测实际MOS绝缘子的边缘效应
提出了一种基于测试芯片I-V测量的预测任意几何形状MOS电容器模式边缘增强漏电流的解析方法。预测结果与实验结果吻合较好。利用这种方法,可以定性地比较不同加工条件下边缘效应的大小。该方法将成为未来lsi中开发高可靠性绝缘子的有力工具。
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Trench DRAM structures for the analysis of two- and three-dimensional leakage phenomena The vertical test structure for measuring contact resistance between two kinds of metal An ovenless electromigration test system environment using test chips with on-chip heating and computer controlled testing Material and process learning by noncontact characterization of minority carrier lifetime and surface recombination condition Edge effect prediction in real MOS insulator using test chips
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