Reliability monitoring of digital circuits by in situ timing measurement

N. P. Aryan, G. Georgakos, D. Schmitt-Landsiedel
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引用次数: 6

Abstract

Recent technological advances in semiconductor industry have led to extreme scaling of CMOS devices. In such advanced technologies fulfilling application specific reliability requirements is not an easy task. This is a crucial issue particularly in case of safety-critical applications with strict reliability requirements. In this paper we propose accurate monitoring of reliability status of digital circuits through measuring the remaining timing slack of the system. Moreover, we propose and evaluate the optimized design and implementation of the required aging resistant circuitry in a low power 65nm technology. Besides the quantitative evaluations regarding the accuracy and robustness of the monitoring circuitry, we evaluate the power efficiency of the monitoring approach for a test circuit. Our studies support the applicability of the proposed monitoring methodology to fulfill application specific reliability requirements.
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数字电路现场定时测量的可靠性监测
最近半导体工业的技术进步导致了CMOS器件的极端缩放。在这些先进的技术中,满足特定于应用程序的可靠性要求并不是一件容易的事。这是一个至关重要的问题,特别是在具有严格可靠性要求的安全关键型应用程序的情况下。本文提出了一种通过测量系统剩余时序松弛来精确监测数字电路可靠性状态的方法。此外,我们提出并评估了在低功耗65nm技术中所需的抗老化电路的优化设计和实现。除了对监测电路的准确性和鲁棒性进行定量评估外,我们还对测试电路的监测方法的功率效率进行了评估。我们的研究支持所提出的监测方法的适用性,以满足特定应用的可靠性要求。
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