{"title":"Design and measurement for high-speed interconnects between chip package, connector and PCB board","authors":"Kaisheng Hu","doi":"10.1109/EPEPS47316.2019.193206","DOIUrl":null,"url":null,"abstract":"Several calibration and de-embedding methods (TRL, ISD and AFR) are checked for both single-ended and differential structures on one test PCB board. The board is also used to evaluated transmission line, PCB parameter extraction and RF transition between package, connector and PCB.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS47316.2019.193206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Several calibration and de-embedding methods (TRL, ISD and AFR) are checked for both single-ended and differential structures on one test PCB board. The board is also used to evaluated transmission line, PCB parameter extraction and RF transition between package, connector and PCB.
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