Deformation of AL Metallization in Plastic Encapsulated Semiconductor Devices Caused by Thermal Shock

Abstract

Deformation of Al metallization was observed during thermal shock tests of plastic encapsulated semiconductor devices. The authors made clear quantitatively the relations between the deformation length and Si chip size, distance from deformation center, molding resin, temperature difference in thermal shock etc. and tried to explain the mechanisms and the cause of this phenomenon.