{"title":"Thematic network \"Adhesives in Electronics\". A two year review and future plans","authors":"H. Kergel","doi":"10.1109/ADHES.2000.860625","DOIUrl":null,"url":null,"abstract":"In order to overcome the problems of the use of adhesives in electronics manufacturing, a so called \"Thematic Network\" on \"Adhesive Joining Technology in Electronics Manufacturing (Adhesives in Electronics)\" was launched March 1998. Within this project, which is funded by the European Community, 52 partners throughout Europe cooperate in order to exchange relevant information and to coordinate future fields for research and development.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860625","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In order to overcome the problems of the use of adhesives in electronics manufacturing, a so called "Thematic Network" on "Adhesive Joining Technology in Electronics Manufacturing (Adhesives in Electronics)" was launched March 1998. Within this project, which is funded by the European Community, 52 partners throughout Europe cooperate in order to exchange relevant information and to coordinate future fields for research and development.
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