{"title":"ULSI design-for-manufacturability: a yield enhancement approach","authors":"A. Tyagi, M. Bayoumi","doi":"10.1109/ICEDTM.1994.496095","DOIUrl":null,"url":null,"abstract":"Yield enhancement is a quintessential objective of the\nsemiconductor industry. With diminishing feature size and increasing\nchip area, the amount of “functional” silicon on a chip is\ntoo expensive to discard in the event of short- and open-circuit faults.\nDesigning chips with high tolerance against faults, therefore, holds\ngreat promise for profitable manufacturing in the semiconductor\nindustry. In this paper, we present an algorithm for integrated circuit\nyield enhancement in the routing phase of layout synthesis. The focus is\non detailed routing. The proposed algorithm reduces layout critical area\nfor short circuits due to two-dimensional spot defects. Critical area\nreduction is achieved in both horizontal and vertical layers without any\npenalties on net length or channel density. Results show yield\nimprovement of 15-25% from the application of the proposed algorithms","PeriodicalId":319739,"journal":{"name":"Proceedings of 3rd International Workshop on the Economics of Design, Test and Manufacturing","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 3rd International Workshop on the Economics of Design, Test and Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEDTM.1994.496095","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Yield enhancement is a quintessential objective of the
semiconductor industry. With diminishing feature size and increasing
chip area, the amount of “functional” silicon on a chip is
too expensive to discard in the event of short- and open-circuit faults.
Designing chips with high tolerance against faults, therefore, holds
great promise for profitable manufacturing in the semiconductor
industry. In this paper, we present an algorithm for integrated circuit
yield enhancement in the routing phase of layout synthesis. The focus is
on detailed routing. The proposed algorithm reduces layout critical area
for short circuits due to two-dimensional spot defects. Critical area
reduction is achieved in both horizontal and vertical layers without any
penalties on net length or channel density. Results show yield
improvement of 15-25% from the application of the proposed algorithms