{"title":"New Resist-Coating Technique Using Fine Mist for Three-Dimensional Nanotechnology","authors":"K. Yamazaki, H. Namatsu","doi":"10.1109/MEMSYS.2006.1627784","DOIUrl":null,"url":null,"abstract":"We have devised a new resist-coating technique for three-dimensional (3D) substrates. The technique uses a quasi-static ambient of very fine mist and enables us to coat a resist film on a 3D substrate such as a cube. We found good conditions for obtaining a resist film with a uniform thickness and smooth surface and succeeded in coating polymethyl-methacrylate on a SiO2/Si cube. Moreover, electron-beam (EB) lithography on the cube resulted in similar patterns on each face of the top and side faces. This technique promises to enable 3D nanofabrication of various materials such as silicon with the resolution of EB lithography.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th IEEE International Conference on Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2006.1627784","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We have devised a new resist-coating technique for three-dimensional (3D) substrates. The technique uses a quasi-static ambient of very fine mist and enables us to coat a resist film on a 3D substrate such as a cube. We found good conditions for obtaining a resist film with a uniform thickness and smooth surface and succeeded in coating polymethyl-methacrylate on a SiO2/Si cube. Moreover, electron-beam (EB) lithography on the cube resulted in similar patterns on each face of the top and side faces. This technique promises to enable 3D nanofabrication of various materials such as silicon with the resolution of EB lithography.
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