Mechanism of Threshold Voltage Instability in SiC MOSFETs and Impacts on Dynamic Switching

Junsong Jiang, Mohan Tian, Wen Ji, Zhihao Hu, Haoran Li, Yuzheng Guo, Zhaofu Zhang, Xi Tang, Cungang Hu, Wenping Cao
{"title":"Mechanism of Threshold Voltage Instability in SiC MOSFETs and Impacts on Dynamic Switching","authors":"Junsong Jiang, Mohan Tian, Wen Ji, Zhihao Hu, Haoran Li, Yuzheng Guo, Zhaofu Zhang, Xi Tang, Cungang Hu, Wenping Cao","doi":"10.1109/ISPSD57135.2023.10147608","DOIUrl":null,"url":null,"abstract":"The threshold voltage ($V_{\\text{TH}}$) instability of silicon carbon (SiC) metal-oxide semiconductor field-effect transistors (MOSFETs) are investigated by pulsed bias characterizations. The $V_{\\text{TH}}$ instability is observed at a time range from nanoseconds (ns) to seconds. The bias induced $V_{\\text{TH}}$ shift caused by is observed within 40 ns. It is also found that a negative gate bias induces a negative $V_{\\text{TH}}$ shift while a positive gate bias induces a positive $V_{\\text{TH}}$ shift. The carrier trapping and de-trapping processes into the gate oxide cause the $V_{\\text{TH}}$ instabilities and they are explained by the energy band diagrams. The TCAD simulations are performed to demonstrate the exsistence of the electric fields to sweep carriers into the trapping region under both positive and negative gate bias conditions. The capacitance-voltage characterizations and first-principles calculations are further carried out to evaluate the defect distribution and explore the intrinsic source of high-density interface traps near the SiC-SiO2 interface.","PeriodicalId":344266,"journal":{"name":"2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"158 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD57135.2023.10147608","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The threshold voltage ($V_{\text{TH}}$) instability of silicon carbon (SiC) metal-oxide semiconductor field-effect transistors (MOSFETs) are investigated by pulsed bias characterizations. The $V_{\text{TH}}$ instability is observed at a time range from nanoseconds (ns) to seconds. The bias induced $V_{\text{TH}}$ shift caused by is observed within 40 ns. It is also found that a negative gate bias induces a negative $V_{\text{TH}}$ shift while a positive gate bias induces a positive $V_{\text{TH}}$ shift. The carrier trapping and de-trapping processes into the gate oxide cause the $V_{\text{TH}}$ instabilities and they are explained by the energy band diagrams. The TCAD simulations are performed to demonstrate the exsistence of the electric fields to sweep carriers into the trapping region under both positive and negative gate bias conditions. The capacitance-voltage characterizations and first-principles calculations are further carried out to evaluate the defect distribution and explore the intrinsic source of high-density interface traps near the SiC-SiO2 interface.
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SiC mosfet阈值电压不稳定机理及其对动态开关的影响
利用脉冲偏置特性研究了硅碳金属氧化物半导体场效应晶体管(mosfet)阈值电压($V_{\text{TH}}$)的不稳定性。$V_{\text{TH}}$不稳定性在纳秒(ns)到秒的时间范围内被观察到。在40 ns内观察到由偏置引起的$V_{\text{TH}}$移位。此外,还发现负栅极偏置诱导负的$V_{\text{TH}}$移位,而正栅极偏置诱导正的$V_{\text{TH}}$移位。栅极氧化物中的载流子捕获和释放过程导致了$V_{\text{TH}}$不稳定性,并用能带图解释了这一不稳定性。通过TCAD仿真证明了在正负栅极偏置条件下,电场的存在将载流子扫入捕获区。通过电容电压表征和第一性原理计算,进一步评估了SiC-SiO2界面附近高密度界面陷阱的缺陷分布,并探索了其本征源。
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