{"title":"Characterization, modeling and optimization of high power module packaging","authors":"M. Trivedi, K. Shenai","doi":"10.1109/EPEP.1997.634049","DOIUrl":null,"url":null,"abstract":"This paper reports the use of two-dimensional numerical simulations in modeling the effects of packaging on the electrical performance of high-power modules. Non-isothermal simulations are performed to study the performance and failure of IGBTs under short-circuit and clamped inductive switching stress.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"404 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634049","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper reports the use of two-dimensional numerical simulations in modeling the effects of packaging on the electrical performance of high-power modules. Non-isothermal simulations are performed to study the performance and failure of IGBTs under short-circuit and clamped inductive switching stress.
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