Gallium arsenide monolithic microwave integrated circuits in IBM

D. Parsons, B. Camp, V. Genova
{"title":"Gallium arsenide monolithic microwave integrated circuits in IBM","authors":"D. Parsons, B. Camp, V. Genova","doi":"10.1109/STIER.1990.324650","DOIUrl":null,"url":null,"abstract":"The activities at IBM Owego to design and manufacture gallium arsenide (GaAs) monolithic microwave integrated circuits (MMIC) for electronic support measure (ESM) microwave receivers are reviewed. The process, circuit design concepts and elements, and completed integrated circuits with results are described. The number of circuit design iterations involving actual wafer fabrication can be significantly reduced, often to one iteration, by the use of accurate design modeling. Much time is spent checking the correlation between predicted and measured results of basic circuit elements such as FETs, coils, capacitors, resistors, diodes, and microwave transmission lines. Often the coupling between these elements is important because of the close spacing required from small size. Once these models are proven to be accurate and realistic, it is then a simple and quick process to use them in the CAD program to generate many different circuit functions. Once the active and passive element models are complete, predictable integrated circuits are readily constructed. The finished devices are mounted in gold plated kovar packages to form more complex higher level functions.<<ETX>>","PeriodicalId":166693,"journal":{"name":"IEEE Technical Conference on Southern Tier","volume":"332 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Technical Conference on Southern Tier","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STIER.1990.324650","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The activities at IBM Owego to design and manufacture gallium arsenide (GaAs) monolithic microwave integrated circuits (MMIC) for electronic support measure (ESM) microwave receivers are reviewed. The process, circuit design concepts and elements, and completed integrated circuits with results are described. The number of circuit design iterations involving actual wafer fabrication can be significantly reduced, often to one iteration, by the use of accurate design modeling. Much time is spent checking the correlation between predicted and measured results of basic circuit elements such as FETs, coils, capacitors, resistors, diodes, and microwave transmission lines. Often the coupling between these elements is important because of the close spacing required from small size. Once these models are proven to be accurate and realistic, it is then a simple and quick process to use them in the CAD program to generate many different circuit functions. Once the active and passive element models are complete, predictable integrated circuits are readily constructed. The finished devices are mounted in gold plated kovar packages to form more complex higher level functions.<>
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IBM的砷化镓单片微波集成电路
回顾了IBM Owego公司为电子支持测量(ESM)微波接收器设计和制造砷化镓(GaAs)单片微波集成电路(MMIC)的活动。介绍了设计过程、电路设计概念和元件,以及完成的集成电路和结果。通过使用精确的设计建模,涉及实际晶圆制造的电路设计迭代次数可以显着减少,通常为一次迭代。大部分时间花在检查基本电路元件(如场效应管、线圈、电容器、电阻、二极管和微波传输线)的预测结果和测量结果之间的相关性上。通常这些元素之间的耦合是很重要的,因为小尺寸需要紧密的间距。一旦这些模型被证明是准确和现实的,然后是一个简单而快速的过程,在CAD程序中使用它们来生成许多不同的电路功能。一旦有源和无源元件模型完成,可预测的集成电路就很容易构建。完成的设备安装在镀金的科瓦包,以形成更复杂的高级功能。
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