{"title":"Packaging Integration White Paper","authors":"Devaryan Gupta","doi":"10.1109/irds54852.2021.00015","DOIUrl":null,"url":null,"abstract":"Packaging Integration (PI) refers to the integration of separately manufactured components into a higher-level assembly that in the aggregate provides enhanced functionality and improved operating characteristics.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/irds54852.2021.00015","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Packaging Integration (PI) refers to the integration of separately manufactured components into a higher-level assembly that in the aggregate provides enhanced functionality and improved operating characteristics.
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